EQS-News: Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology
Hanau/Garching, 5 March 2024 – Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.
EQS-News: SÜSS MicroTec SE / Key word(s): Alliance Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology 05.03.2024 / 09:01 CET/CEST The issuer is solely responsible for the content of this announcement. Hanau/Garching, 5 March 2024 – Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.
05.03.2024 CET/CEST Dissemination of a Corporate News, transmitted by EQS News - a service of EQS Group AG. |
Language: | English |
Company: | SÜSS MicroTec SE |
Schleissheimer Strasse 90 | |
85748 Garching | |
Germany | |
Phone: | +49 (0)89 32007-161 |
Fax: | +49 (0)89 4444 33420 |
E-mail: | [email protected] |
Internet: | www.suss.com |
ISIN: | DE000A1K0235 |
WKN: | A1K023 |
Indices: | SDAX |
Listed: | Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange |
EQS News ID: | 1851079 |
End of News | EQS News Service |
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1851079 05.03.2024 CET/CEST